Chip foam ea koporo e teteaneng haholo
Lintlha tsa Sehlahisoa
Foam ea koporo e sebelisoa haholo ho lokiseng lisebelisoa tse tsamaisang anode ea betri, li-electrode substrates bakeng sa libeteri tsa lithium ion kapa mafura, li-catalyst carriers tsa betri le lisebelisoa tse sireletsang motlakase. Foam ea koporo, haholo-holo, e na le melemo e ikhethang joalo ka karoloana ea li-electrode tsa betri.
1. Foam ea koporo e na le conductivity e ntle ea mocheso le motlakase oa motlakase, 'me e ka sebelisoa e le matrix a electrode ea libeteri tsa lithium-ion, lisele tsa mafura, libeteri tsa nickel-zinc le lisebelisoa tsa electrode bakeng sa li-capacitor tsa motlakase habeli.
2. Foam ea koporo e ka boela ea sebelisoa e le thepa ea ho qhala mocheso, lisebelisoa tsa ho kenya mocheso, mochine oa lik'hemik'hale oa lik'hemik'hale, lisebelisoa tsa tšireletso ea motlakase, lisebelisoa tsa filthara, lisebelisoa tsa damping, lisebelisoa tsa electrode tsa betri, lisebelisoa tsa ho koala molumo, le lisebelisoa tse khabisitsoeng tse phahameng.
Lintlha Tse ka Sehloohong
lintho tse bonahalang: koporo ea foam, bohloeki> 99%,
Boholo: Standard 500 * 500mm, e ka khaoloa ho latela litlhoko tsa bareki.
Ho ea ka litlhoko tsa bareki, libopeho tse fapaneng tsa foam ea koporo li ka hlahisoa. Copper e pota-potileng ea foam joalo-joalo.
Botenya: 5 ~ 65mm
Porosity: ≥95%, 5 ~ 40PPI
Ka sekhahla sa lesoba: ≥95%
Boima ba bokaholimo: 0.1 ~ 2.0g/m3
Ho paka le ho Romela
Sephutheloana sa Vacuum + nitrogen, sephutheloana se tloaelehileng sa lepolanka sa kantle ho naha kapa ho latela litlhoko tsa bareki.






