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Mokhoa oa ho etsa foam ea koporo?

Tlhaloso e Khutšoanyane:

Foam ea koporo ke mofuta o mocha oa thepa e sebetsang ka bongata e nang le palo e kholo ea li-pores tse kopantsoeng kapa tse sa amaneng ka mokhoa o ts'oanang o abuoa ka matrix a koporo. Foam ea koporo e na le conductivity e ntle le ductility. Ha e bapisoa le foam ea nickel, e na le litšenyehelo tse tlase tsa ho itokisa le conductivity e ntle, 'me e ka sebelisoa ho lokisa lisebelisoa tsa electrode (carrier), catalyst carrier le electromagnetic shielding material.
Haholo-holo, koporo e phophomang e na le melemo e meng e totobetseng e le karoloana ea li-electrode tsa betri, empa hobane koporo ha e hanyetse ho bola joalo ka nickel, e boetse e fokotsa tse ling tsa lits'ebetso tsa eona.

Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

Foam ea koporo-01
Foam ea koporo ke mofuta o mocha oa thepa e sebetsang ka bongata e nang le palo e kholo ea li-pores tse kopantsoeng kapa tse sa amaneng ka mokhoa o ts'oanang o abuoa ka matrix a koporo. Foam ea koporo e na le conductivity e ntle le ductility. Ha e bapisoa le foam ea nickel, e na le litšenyehelo tse tlase tsa ho itokisa le conductivity e ntle, 'me e ka sebelisoa ho lokisa lisebelisoa tsa electrode (carrier), catalyst carrier le electromagnetic shielding material.
Haholo-holo, koporo e phophomang e na le melemo e meng e totobetseng e le karoloana ea li-electrode tsa betri, empa hobane koporo ha e hanyetse ho bola joalo ka nickel, e boetse e fokotsa tse ling tsa lits'ebetso tsa eona.
Koporo e phophomang e lokiselitsoe ke metallurgy ea phofo le electroplating, 'me tšepe e phophomang e lokisoa ka ho eketsa ntho e phophomang ka tšepe e qhibilihisitsoeng;
1.Powder metallurgy metal foams e entsoeng ka ho eketsa ntho e fokang (e kang NH4Cl) ho phofo, sesebelisoa se fofang se senyeha nakong ea sintering, se siea likheo.
2. Electrochemical deposition method e ka sebelisoa ho lokisetsa tšepe e foamed e nang le sebōpeho se tloaelehileng le porosity ho fihlela ho 95%, ho akarelletsa le foams ea tšepe e nang le Cu, Ni, NiCrFe, ZnCu, NiCu, NiCrW, NiFe le lisebelisoa tse ling le li-alloys e le skeleton.

Tšepe e kenngoa 'meleng oa porous ka mokhoa oa electrochemical,' me likarolo tse behiloeng li kopantsoe hammoho ka sintering, 'me matla a fihla ho foam e hlokahalang ea tšepe e phahameng, e nang le porosity e phahameng' me e ka tlatsoa ka lisebelisoa tse ngata, tse kang li-catalysts. . electrolyte, joalo-joalo.
3. Ka lesobafoam ea koporoe lokiselitsoe ka ts'ebetso ea sintering-desolvation, 'me phofo ea koporo ea electrolytic, likaroloana tsa NaCl le li-additives li kopantsoe ka mokhoa o ts'oanang' me li hatelloa ka li-compact tse tala. Sebōpi sa sintering se behoa moeeng oa argon bakeng sa sintering, 'me sehlahisoa se fumanoeng se behoa metsing a chesang a potolohang. Qhala ka sesebediswa, ka nako eo hlatsoa le ultrasonic metsi bath le acetone, 'me qetellong omisitsoe ho theha pores bulehileng, tse entsoeng ka litsela tse tharo tse amanang sebaka marangrang, le porosity ea 50-81%, ka karolelano pore bophara ba 0.2- 4 mm, le kabo ea pore.

Foam ea koporo-02


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