Seponche sa Copper Sponge Electrode Substrate ea Lithium Iron Battery Material
Copper foamed e na le thepa e ntle ea mochini le thepa ea ts'ebetso, e ntle haholo ea motlakase le ea mocheso, 'me e na le palo e kholo ea likarolo tse tharo tsa likarolo tse tharo tsa porous ka har'a thepa. Ka nako e ts'oanang, e na le khanyetso ea kutu ea alkali, matla a matle a thata le ductility ea koporo ea tšepe ka boeona. Hape e na le tšireletso e ntle ea motlakase le ho fokotsa lerata ho ts'oara. E ka sebelisoa haholo ho futhumatsa mocheso le thepa ea phapanyetsano ea mocheso ea likarolo tsa elektroniki joalo ka cpu, likarete tsa litšoantšo, li-LED, lisebelisoa tsa ho boloka matla a feto-fetohang, lisebelisoa tsa meralo, lithium ion kapa lisebelisoa tsa elektrode tsa mafura, lisebelisoa tsa ho fokotsa lerata, motlakase oa motlakase. thepa e sireletsang, thepa ea mohaho, Lifilimi tse fapa-fapaneng tsa mantlha, li-catalysts le bajari, joalo-joalo.
| Botenya | 0.15~0.45g/cm3 | |||||
| Porosity | 5 ~ 120 PPI | |||||
| Botenya | 0.5-25 limilimithara | |||||
| Spec | ≤500mm * 500mm | |||||
| Element | Ka | Ho | Fe | S | C | Le |
| Tataiso(ppm) | Ho leka-lekanya | 0.5~5% | ≤100 | ≤80 | ≤100 | ≤50 |







